Part Number Hot Search : 
ASI10578 C8051 HYS64T 2E30UM 3S5DC FN2169 TG2213S 11N60C
Product Description
Full Text Search
 

To Download SFP630 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 SFP630
Silicon N-Channel MOSFET
Features
9A, 200V, RDS(on)(Max 0.4)@VGS=10V Ultra-low Gate Charge(Typical 43nC) Fast Switching Capability 100%Avalanche Tested Maximum Junction Temperature Range(150)
General Description
This Power MOSFET is produced using Winsemi's advanced planar stripe, DMOS technology. This latest technology has been especially designed to minimize on-state resistance, have a high rugged avalanche characteristics. This devices is specially well suited for low voltage applications such as automotive, high efficiency switching for DC/DC converters, and DC motor control.
G D S
TO220
Absolute Maximum Ratings
Symbol
VDSS Drain Source Voltage
Parameter
Continuous Drain Current(@Tc=25) Continuous Drain Current(@Tc=100) Drain Current Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation(@Tc=25) Derating Factor above 25 Junction and Storage Temperature Maximum lead Temperature for soldering purposes (Note 2) (Note 1) (Note 3) (Note1)
Value
200
Units
V
ID IDM VGS EAS EAR dv/dt PD TJ, Tstg TL
9 5.7 36 30 160 7.2 5.5 72 0.57 -55~150 300
A A A V mJ mJ V/ns W W/
Thermal Characteristics
Symbol
RQJC RQCS RQJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Case to Sink Thermal Resistance, Junction-to-Ambient
Min
-
Value Typ
0.5 -
Max
1.74 62.5
Units
/W /W /W
Rev, C Dec.2008
Copyright@WinSemi Semiconductor Co.,Ltd.,All rights reserved.
T01-3
SFP630
Electrical Characteristics (Tc = 25C) 25
Characteristics
Gate leakage current Gate-source breakdown voltage Drain cut-off current Drain-source breakdown voltage Break Voltage Temperature Coefficient Gate threshold voltage Drain-source ON resistance Forward Transconductance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-on time Switching time Fall time Turn-off time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("miller") Charge Qg Qgs Qgd tf toff VDD = 160 V, VGS = 10 V, ID = 5.9 A (Note4,5) 7 23 nC RG=12 (Note4,5) 39 20 43 -
Symbol
IGSS V(BR)GSS IDSS V(BR)DSS BVDSS/ TJ VGS(th) RDS(ON) gfs Ciss Crss Coss tr ton
Test Condition
VGS = 30 V, VDS = 0 V IG = 10 A, VDS = 0 V VDS = 200 V, VGS = 0 V ID = 250 A, VGS = 0 V ID=250A, Referenced to 25
Min
30 200 -
Type
0.2
Max
100 10 -
Unit
nA V A V V/
VDS = 10 V, ID =250 A VGS = 10 V, ID = 5.4A VDS = 50 V, ID =5.4A VDS = 25 V, VGS = 0 V, f = 1 MHz VDD =100 V, ID = 5.9 A
2 3.8 -
800 240 76 9.4 28
4 0.4 -
V S
pF
ns
Source-Drain Ratings and Characteristics (Ta = 25C) Source- 25
Characteristics
Continuous drain reverse current Pulse drain reverse current Forward voltage (diode) Reverse recovery time Reverse recovery charge
Symbol
IDR IDRP VDSF trr Qrr
Test Condition
IDR = 9 A, VGS = 0 V IDR = 5.9A, VGS = 0 V, dIDR / dt = 100 A / s
Min
-
Type
1.4 170 1.1
Max
9 36 2.0 340 2.2
Unit
A A V ns C
Note 1.Repeativity rating :pulse width limited by junction temperature 2.L=500uH,IAS=9 A,VDD=50V,RG=0,Starting TJ=25 3.ISD9A,di/dt300A/us, VDD2/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.
SFP630
Fig. 1 On-State Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance Variation vs Drain Current
Fig.4 Body Diode Forward Voltage Variation vs. Source Current and Temperature
Fig.5 On-Resistance Variation vs Junction Temperature
Fig.6 Gate Charge Characteristics
3/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.
SFP630
Fig.7 Maximum Safe Operation Area
Fig.8 Maximum Drain Current vs Case Temperature
Fig.9 Transient Thermal Response Curve
4/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.
SFP630
Fig.10 Gate Test Circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Unclamped Inductive Switching Test Circuit & Waveform
5/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.
SFP630
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
6/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.
SFP630
TO-220 Package Dimension
7/7
Copyright @ WinSemi Semiconductor Co., Ltd., All rights reserved.


▲Up To Search▲   

 
Price & Availability of SFP630

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X